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Wafer saw Disco Technologies Japan DAD3350

Basic Information

Name: Wafer saw
Manufacturer: Disco Technologies Japan
Model: DAD3350
Facility: Chair for Semiconductor Technology (HLT)
Partner: Technische Universität Dresden (TUD)
Location: Cleanroom Mierdel-Bau

Description

bis 200 mm

Points of Contact

Prof. Dr. rer. nat. J.W. Bartha/ Mrs. R. Pfennig (Secretary)
Email:
Phone:
+49 351 463-35468
Fax:
+49 351 463-37172

Images

Last Update

Last updated at: 27 March 2018 at 11:22:05