View all instruments of this unit Wafer saw Disco Technologies Japan DAD3350
Basic Information
| Name: | Wafer saw | |
| Manufacturer: | Disco Technologies Japan | |
| Model: | DAD3350 | |
| Facility: | Chair for Semiconductor Technology (HLT) | |
| Partner: | Technische Universität Dresden (TUD) |
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| Location: | Cleanroom Mierdel-Bau | |
Description
bis 200 mm
Points of Contact
Prof. Dr. rer. nat. J.W. Bartha/ Mrs. R. Pfennig (Secretary)
Web:
Email:
Phone:
+49 351 463-35468
Fax:
+49 351 463-37172
Images
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Last Update
Last updated at: 27 March 2018 at 11:22:05