All Silicon System Integration Dresden (ASSID)
Fraunhofer IZM-ASSID - All Silicon System Integration Dresden- has been established with a focus on advanced wafer level packaging and system integration technologies, especially with respect to 3D wafer level system integration using Through Silicon Vias (Cu-TSC). ASSID operated a leading edge 300 mm wafer process line for TSV formation, 3D device stacking and assembly. The facility is equipped with leading edge process tools according to industrial requirements for manufacturing. The service includes customer specific development and prototyping, low volume manufacturing and process transfer as well.

Specific focus of ASSID are Cu-TSV process integration (Via middle, last process), Silicon interposer for heterogeneous device integration, wafer level assembly and 3D stack formation.

With major equipment and material suppliers also specific Joint Development Projects are settled up to meet the targets for next generation 3D wafer level integration.