Micro- and Nanostructures (Department)

Parent Units:
Leibniz Institute for Solid State and Materials Research (IFW Dresden)

Contact

web:	https://www.ifw-dresden.de/institutes/institute-for-complex-materials/
email:	e-mail
phone:	+49 (0) 351 4659-217
fax:	+49 (0) 351 4659-452
address:	Leibniz Institute for Solid State and Materials Research (IFW Dresden), Micro- and Nanostructures, Helmholtzstr. 20, 01069 Dresden
partner:	Leibniz Institute for Solid State and Materials Research

Expertise

In our department, micro- and nanostructured materials and devices are investigated. This ranges from the basic interaction of Fe with C, the deposition of metals films by various methods up to functional devices and applications based on surface acoustic wave (SAW) technology. Furthermore, modern transmission electron microscopy (TEM) is used to image and characterize nano structured materials on a nanometer scale. The spectroscopic methods we use are Energy Dispersive X-ray Spectroscopy (EDXS) and Electron Energy Loss Spectroscopy (EELS and ELNES). Material classes include thin metallic films, multi layers having special magnetic or electronic properties, molecular nanostructures like graphene or carbon nanotubes, and other interesting materials. Also various in-situ experiments are carried out in the electron microscopes.

Research Topics

Surface Acoustic Waves: Concepts, Materials & Applications	Preparation, microstructure investigation and structuring of functional thin films (e.g. metallization layers, dielectrics, piezoelectrics) SAW devices and damage processes by acoustomigration Technology platform for SAW-based microfluidic actuation Surface Acoustic Wave (SAW) based aerosol generation / fluid atomization Backend chip processing (e.g. dicing, wire bonding) Thin film analytics ...for further information please visit SAWLab Saxony
Nanostructures:	HRTEM Imaging for improving or monitoring synthesis of novel or standard, organic or inorganic nanotubes or nanowires Manipulation of individual Nanotubes Metal coating of Carbon-nanotubes Patterning and structuring of Materials Applications Surface segregation at fine oxide powders
Analytical Methods:	Spectrometric solid state analysis Optimization of ARXPS for various applications Computer simulation of roughness for angle-resolved XPS Determination of local valence of transition metals by ELNES Atomistic and electronic structure of interfaces Highly localized strain measurements by CBED XPS-Analysis of insulating thin films Atomistic structure determination by incoherent electron scattering Application of chemometrics to electron spectra
Materials and Devices for Microelectronics:	Diffusion Barriers Electromigration in interconnects Analysis of defects in interconnects by the Auger microprobe: Local analysis, Elemental mapping Structural investigation of functional multilayers for GMR and TMR applications
Deposition processes:	Cu Deposition for microelectronic applications Deposition of Cu-based alloys Investigations at insulating thin films using XPS Investigation of diffusion and reaction in thin films. Example: Depth profile analysis of electrodeposited CoPt films
Composite Materials:	Phase Composition Nearest neighbour correlations Microstructure SIMS measurements of oxygen content in the Nd2Fe14B phase

Overview available methods

The following methods are available and can be performed in the department:

TEM - Transmission Electron Microscopy	CTEM (Conventional Transmission Electron Microscopy) ED (Electron Diffraction) HRTEM (High Resolution Transmission Electron Microscopy) STEM (Scanning Transmission Electron Microscopy) EDX (Energy Dispersive X-ray spectrometry) EELS (Electron Energy Loss Spectrometry) EFTEM (Energy Filtered Transmission Electron Microscopy)
SEM - Scanning Electron Microscopy	WDX (Wave Length Dispersive Spectroscopy EDX (Energy Dispersive X-ray Spectroscopy) EBSD (Electron Back-Scatter Diffraction)
FIB - Focussed Ion Beam	Imaging with Ions Structuring with Ions Local Deposition of Metal Films by Ions and Electrons (EBID & IBID)
Deposition of Films with the Clustertool CARMEN	DC magnetron co-sputtering of metals HF magnetron sputtering of metals and barrier films HF magnetron sputtering of insulators E-beam evaporation of metals

Further methods:

Glow Discharge Optical Emission Spectrometry (GD-OES)
Measurement of Layer Thicknesses (Optical & Mechanical & Analytical)
Life Time Measurements of Electronic Devices
Electrical Resistance Measurements
Surface Analysis
AFM
Nanomanipulation (in LM, SEM, FIB, TEM)
Measuring strength of ductile thin films

instruments

View instruments (2)

Affiliations

Parent Units

name	type	actions
Institute for Complex Materials (IKM)	Institute	view

Last Update

Last updated at: 2017-02-21 10:12