Mask Aligner für Photolithographie-Anwendungen in den Bereichen Advanced-Packaging, 3D-Packaging, MEMS, Interposer-Technologien, Fotovoltaik, Nanotechnologie und Wafer- und Board-Level-Optik

Anwendung

Photolithographie-Anwendungen in den Bereichen Advanced-Packaging, 3D-Packaging, MEMS, Interposer-Technologien, Fotovoltaik, Nanotechnologie und Wafer- und Board-Level-Optik

Eigenschaften

• Manual wafer load mask aligner
• Top Side Alignment (TSA), 10x microscope objectives
• Capable of Hard, Soft, Vacuum and Proximity Contact
• X, Y, Theta alignment with motorized linear stages
• Separation alignment: 5-400 µm (1 µm step)
• 3 point wedge compensation
• Configured for 8"/200 mm wafers (8"/200 mm wafer chuck)
• Maskholder: 5"x5", 9"x9" (with round and rectangular opening) and transparent (glass) holder for foil masks
• 1000 W Lamp House (16 mW/cm2 @ 356 nm)
• Vibration Isolation Table (built into system)