View all instruments of this unit Mask Aligner EV Group EVG 640
Basic Information
| Name: | Mask Aligner | |
| Manufacturer: | EV Group | |
| Model: | EVG 640 | |
| Facility: | Institute of Electronic Packaging Technology (IAVT) |
|
| Partner: | Technische Universität Dresden (TUD) |
|
| Location: | WHB 157 | |
Short Description
Mask Aligner für Photolithographie-Anwendungen in den Bereichen Advanced-Packaging, 3D-Packaging, MEMS, Interposer-Technologien, Fotovoltaik, Nanotechnologie und Wafer- und Board-Level-Optik
Description
Anwendung
Photolithographie-Anwendungen in den Bereichen Advanced-Packaging, 3D-Packaging, MEMS, Interposer-Technologien, Fotovoltaik, Nanotechnologie und Wafer- und Board-Level-Optik
Eigenschaften
- Manual wafer load mask aligner
- Top Side Alignment (TSA), 10x microscope objectives
- Capable of Hard, Soft, Vacuum and Proximity Contact
- X, Y, Theta alignment with motorized linear stages
- Separation alignment: 5-400 µm (1 µm step)
- 3 point wedge compensation
- Configured for 8"/200 mm wafers (8"/200 mm wafer chuck)
- Maskholder: 5"x5", 9"x9" (with round and rectangular opening) and transparent (glass) holder for foil masks
- 1000 W Lamp House (16 mW/cm2 @ 356 nm)
- Vibration Isolation Table (built into system)
Points of Contact
Prof. Dr.-Ing. Dr. h.c. K. Bock/ Mrs. S. Taupitz (Secretary)
Web:
Email:
Phone:
+49 (0) 351 463-36345
Fax:
+49 (0) 351 463-37035
Images
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Source: © IAVT |
Mask Aligner EV Group EVG 640 |
Last Update
Last updated at: 6 July 2018 at 14:43:06