Institute of Electronic Packaging Technology (IAVT)Parent Units:
Technische Universität Dresden (TUD)
German name: "Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT)".
|phone:||+49 (0) 351 463-36345|
|fax:||+49 (0) 351 463-37035|
|postal address:||Technische Universität Dresden (TUD), Institute of Electronic Packaging Technology (IAVT), Helmholtzstr. 10, 01069 Dresden, Germany|
|office address:||Technische Universität Dresden (TUD), Institute of Electronic Packaging Technology (IAVT), Mommsenstr. 15 (Günther-Landgraf-Building, room 7-105), 01069 Dresden, Germany|
|partner:||Technische Universität Dresden|
The Electronic Packaging Laboratory (German abbreviation: IAVT) and the Center of Microtechnical Manufacturing (German abbreviation: ZmP) are working together for more than 10 years in research and education. Together they represent one of the largest university research institutions in Germany active in the field of Electronic Packaging.
A unique selling point of IAVT/ZmP is the comprehensive consideration of Electronic Packaging as a unified whole of procedure and process technologies and the additional regarding of product process specific topics.
Electronics packaging influences decisively the functional properties, the reliability and the costs of the whole electronic system. The drivers of this progression are the trends in system integration:
- Reduction of dimensions and volumes
- Increasing the number of functions and the switching frequencies
- Reduction of costs
IAVT and ZmP are structuring their research activities in "working fields". Those working fields are geared to the recent research and development needs in fundamental research as well as in industry related applied research. The scope of the working fields also reflects the holistic approach for system integration as an unity of processes an technologies.
The working fields are:
- bio-compatible electronic packaging,
- organic and inorganic substrate technologies,
- assembling technologies for first-level- and second-level interconnects,
- micro- and nano materials for system integration,
- process optimization and quality management,
- develoment of sensors for non-destructive testing and structural health monitoring,
- 3D integration and optical interconnect technologies,
- module reliability and material parameters of interconnect materials,
- characterization and diagnostics in electronic packaging.
Object of the research work is the comparison, analysis and selection of suitable technologies and materials to ensure reliable packaging as well as the development, diagnostic and reliability evaluation of new packaging technologies.
|Faculty of Electrical and Computer Engineering||Faculty|
|Centre of Microtechnical Manufacturing (ZmP)||Center|
Last updated at: 2016-11-17 10:27