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Institute of Electronic Packaging Technology (IAVT)

Parent Units:
Technische Universität Dresden (TUD)
German name: "Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT)".


web: https://www.avt.et.tu-dresden.de/
email: e-mail
phone: +49 (0) 351 463-36345
fax: +49 (0) 351 463-37035
postal address: Technische Universität Dresden (TUD), Institute of Electronic Packaging Technology (IAVT), Helmholtzstr. 10, 01069 Dresden, Germany
office address: Technische Universität Dresden (TUD), Institute of Electronic Packaging Technology (IAVT), Mommsenstr. 15 (Günther-Landgraf-Building, room 7-105), 01069 Dresden, Germany
partner: Technische Universität Dresden


The Electronic Packaging Laboratory (German abbreviation: IAVT) and the Center of Microtechnical Manufacturing (German abbreviation: ZmP) are working together for more than 10 years in research and education. Together they represent one of the largest university research institutions in Germany active in the field of Electronic Packaging.

A unique selling point of IAVT/ZmP is the comprehensive consideration of Electronic Packaging as a unified whole of procedure and process technologies and the additional regarding of product process specific topics.

Electronics packaging influences decisively the functional properties, the reliability and the costs of the whole electronic system. The drivers of this progression are the trends in system integration:


  • Reduction of dimensions and volumes
  • Increasing the number of functions and the switching frequencies
  • Reduction of costs


IAVT and ZmP are structuring their research activities in "working fields". Those working fields are geared to the recent research and development needs in fundamental research as well as in industry related applied research. The scope of the working fields also reflects the holistic approach for system integration as an unity of processes an technologies.

The working fields are:


Object of the research work is the comparison, analysis and selection of suitable technologies and materials to ensure reliable packaging as well as the development, diagnostic and reliability evaluation of new packaging technologies.


View instruments (3)


Parent Units

name type actions
Faculty of Electrical and Computer Engineering Faculty view

Daughter Units

name type instruments services
Centre of Microtechnical Manufacturing (ZmP) Center

Last Update

Last updated at: 2016-11-17 10:27