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Cut-off grinding of diffrent substrates

Basic Information

Name: Cut-off grinding of diffrent substrates
Facility: Chair for Semiconductor Technology (HLT)
Partner: Technische Universität Dresden (TUD)

Short Description

Trennschleifen verschiedener Substrate mit max. 200mm Durchmesser und Substratmaterialien (Si, Saphir, Gläser).

Description

Details:

  • max. 200mm Durchmesser
  • Substratmaterialien (Si, Saphir, Gläser)

Points of Contact

Dr.rer.nat. Wenzel, Christian
Position:
Institutsoberassistent / senior scientist
Email:
Phone:
+4935146336413
Fax:
+4935146337172
Prof. Dr. rer. nat. J.W. Bartha/ Mrs. R. Pfennig (Secretary)
Email:
Phone:
+49 351 463-35468
Fax:
+49 351 463-37172

Last Update

Last updated at: 27 March 2018 at 11:03:47