View all services of this unit Cut-off grinding of diffrent substrates
Basic Information
| Name: | Cut-off grinding of diffrent substrates | |
| Facility: | Chair for Semiconductor Technology (HLT) | |
| Partner: | Technische Universität Dresden (TUD) |
|
Short Description
Trennschleifen verschiedener Substrate mit max. 200mm Durchmesser und Substratmaterialien (Si, Saphir, Gläser).
Description
Details:
- max. 200mm Durchmesser
- Substratmaterialien (Si, Saphir, Gläser)
Points of Contact
Dr.rer.nat. Wenzel, Christian
Position:
Institutsoberassistent / senior scientist
Phone:
+4935146336413
Fax:
+4935146337172
Prof. Dr. rer. nat. J.W. Bartha/ Mrs. R. Pfennig (Secretary)
Phone:
+49 351 463-35468
Fax:
+49 351 463-37172
Last Update
Last updated at: 27 March 2018 at 11:03:47