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Services of Chair for Semiconductor Technology

Technische Universität Dresden
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Wafer Coating

Facility: Chair for Semiconductor Technology

Waferbeschichtung - Oxidation, PECVD-, ALD- und PVD-Prozesse für Herstellung funktionaler Schichten und Schichtsysteme, Diffusionsbarrieren, Metallisierungen verschiedener Einsatzbereiche.

 

Additive and subtractive wiring technology

Facility: Chair for Semiconductor Technology

Additive and subtractive wiring technology - e.g. Damascene structuring.

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