View all services of this unit Screening Fab Services
Basic Information
| Name: | Screening Fab Services | |
| Facility: | 300 mm CMOS Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
Description
With the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners.
For processing customer orders, 2700 m² of clean room space of class 6 and 3 (according to ISO 14644-1) as well as laboratory space for more than 80 processing and analytical tools are available. The equipment park includes deposition and etching systems as well as inspection and analysis equipment for determining defects and measuring layer properties.
In the area of FEoL and BEoL we offer the following technology developments and services on Ultra Large Scale Integration level (ULSI):
- Atomic Layer Deposition (ALD)
- Nanopatterning / E-Beam Lithography
- Chemical Mechanical Polishing (CMP)
- Wafer Metallization
- Wafer Cleaning
- Wafer Services
- Analytical Services & Metrology
Types of Service
- This service is provided as a standard/ routine service without research activity.
- This service is provided as a research activity e.g. as a development or improvement of methods tools or within research collaborations.
Points of Contact
Associated Instruments
| Name | Preview | Actions |
|---|---|---|
| Wafer Plating | ||
| Nanopatterning via E-Beam Lithography | ||
| Atomic Layer Deposition (ALD) | ||
| Wafer Cleaning |
Last Update
Last updated at: 17 January 2025 at 15:00:13