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Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT)

übergeordnete Einrichtungen:
Technische Universität Dresden (TUD)

Kontakt

Web: https://www.avt.et.tu-dresden.de/
E-Mail:
Telefon: +49 (0) 351 463-36345
Fax: +49 (0) 351 463-37035
Postanschrift: Technische Universität Dresden (TUD), Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT), Helmholtzstr. 10, 01069 Dresden, Germany
Besucheradresse: Technische Universität Dresden (TUD), Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT), Mommsenstr. 15 (Günther-Landgraf-Building, room 7-105), 01069 Dresden, Germany
Partner: Technische Universität Dresden

Beschreibung

The Electronic Packaging Laboratory (German abbreviation: IAVT) and the Center of Microtechnical Manufacturing (German abbreviation: ZmP) are working together for more than 10 years in research and education. Together they represent one of the largest university research institutions in Germany active in the field of Electronic Packaging.

A unique selling point of IAVT/ZmP is the comprehensive consideration of Electronic Packaging as a unified whole of procedure and process technologies and the additional regarding of product process specific topics.

Electronics packaging influences decisively the functional properties, the reliability and the costs of the whole electronic system. The drivers of this progression are the trends in system integration:

 

  • Reduction of dimensions and volumes
  • Increasing the number of functions and the switching frequencies
  • Reduction of costs

 

IAVT and ZmP are structuring their research activities in "working fields". Those working fields are geared to the recent research and development needs in fundamental research as well as in industry related applied research. The scope of the working fields also reflects the holistic approach for system integration as an unity of processes an technologies.

The working fields are:

 

Object of the research work is the comparison, analysis and selection of suitable technologies and materials to ensure reliable packaging as well as the development, diagnostic and reliability evaluation of new packaging technologies.

Geräte

Geräte anzeigen (3)

Zugehörigkeit

übergeordnete Einrichtungen

Name
Typ
Aktionen
Fakultät Elektrotechnik und Informationstechnik Fakultät anzeigen

untergeordnete Einrichtungen

Name
Typ
Geräte
Dienstleistungen
Zentrum für mikrotechnische Produktion (ZmP) Zentrum

Letztes Update

Letztes Update am: 17.11.2016 10:27