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View all instruments of this unit Wafer Dicing DISCO Corp. DAD 651
Basic Information
| Name: | Wafer Dicing | |
| Manufacturer: | DISCO Corp. | |
| Model: | DAD 651 | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
| Inventory number: | DICING-SAW01 | |
Description
Dicing of Glass-Silicon-Compound
Options of instrument usage
- This instrument is used within a service or research collaboration.
Points of Contact
Associated Services
| Name | Preview | Actions |
|---|---|---|
| Bonding and assembly of wafer |
Last Update
Last updated at: 14 January 2025 at 13:44:39