Fraunhofer IPMS develops for its customers products and technologies in the realm of microelectromechanical systems (MEMS), and micro-opto-electro-mechanical systems (MOEMS). Our capabilities span the entire development arc for MEMS and MOEMS products and technologies. Upon request, we can either undertake in-house pilot and low-volume fabrication, or support technology transfer to a facility of the client's choice. In these endeavors, we use our existing technological capabilities for bulk MEMS, surface MEMS, and the monolithic integration of CMOS and MEMS/MOEMS. Our work is performed in a state-of-the-art MEMS clean room, capable of handling 150 mm wafers.

For more information see Brochure.