View all services of this unit Bonding and assembly of wafer
Basic Information
| Name: | Bonding and assembly of wafer | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
Description
We offer different processes for bonding, assembly of wafers and automatic visual inspections.
- Wafer bonding
- Wafer dicing
- Wafer packaging
- Laser Marking
- Material Test
- Laser Scanning Microscope
Types of Service
- This service is provided as a standard/ routine service without research activity.
- This service is provided as a research activity e.g. as a development or improvement of methods tools or within research collaborations.
Points of Contact
Associated Instruments
| Name | Preview | Actions |
|---|---|---|
| Wafer Bonding | ||
| Material Test | ||
| Laser Scanning Microscope | ||
| Wafer Dicing | ||
| Wafer Packaging |
Last Update
Last updated at: 14 January 2025 at 13:41:59