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We will provide a link to the successor service once it goes live.
Please do not update any equipment entries here anymore. Use the new portal from now on.
View all services of this unit Bonding and assembly of wafer
Basic Information
| Name: | Bonding and assembly of wafer | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
Description
We offer different processes for bonding, assembly of wafers and automatic visual inspections.
- Wafer bonding
- Wafer dicing
- Wafer packaging
- Laser Marking
- Material Test
- Laser Scanning Microscope
Types of Service
- This service is provided as a standard/ routine service without research activity.
- This service is provided as a research activity e.g. as a development or improvement of methods tools or within research collaborations.
Points of Contact
Associated Instruments
| Name | Preview | Actions |
|---|---|---|
| Wafer Bonding | ||
| Material Test | ||
| Laser Scanning Microscope | ||
| Wafer Dicing | ||
| Wafer Packaging |
Last Update
Last updated at: 14 January 2025 at 13:41:59