Präzisionsmechanische Fertigung

Facility: Werkstattteil Präzisionsmechanik

Multimodal Scene Creation

Facility: Chair of Acoustics and Haptics

Sound and Vibration Measurements

Facility: Chair of Acoustics and Haptics

Wafer Coating

Facility: Chair for Semiconductor Technology

Waferbeschichtung - Oxidation, PECVD-, ALD- und PVD-Prozesse für Herstellung funktionaler Schichten und Schichtsysteme, Diffusionsbarrieren, Metallisierungen verschiedener Einsatzbereiche.

Si-deep etching for MEMS, MOEMS and microfluidic

Facility: Chair for Semiconductor Technology

Si-deep etching for MEMS, MOEMS and microfluidic.

Additive and subtractive wiring technology

Facility: Chair for Semiconductor Technology

Additive and subtractive wiring technology - e.g. Damascene structuring.

Chemical layer structuring

Facility: Chair for Semiconductor Technology

Cut-off grinding of diffrent substrates

Facility: Chair for Semiconductor Technology

Design of digital electronic circuits based on programmable logic (FPGA/PLD,VHDL)

Facility: Group for Design of Electronic Systems

Investigation and analysis of the operational behavior of miniature electromechanichal gears and of toothed belt drives (e.g., transmission behavior, noises)

Facility: Group for Electromechanical Design