View all instruments of this unit Inline Metrology
Basic Information
| Name: | Inline Metrology | |
| Facility: | Analytics and Metrology of the 300 mm CMOS Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
Description
Physical and chemical characterization of full wafers with high throughput without affecting the functionality of the wafer dies is a key to monitor the production of semiconductor devices. At Fraunhofer IPMS we have a number of different in-line metrology tools for the measurement of film thicknesses, sheet resistance, surface composition, chemical binding states, surface and sidewall topographies and for defect inspection on 200 and 300 mm wafers.
Capabilities
- Surface composition wafer-mapping (Thermo Fisher Theta300i ARXPS)
- Profilometry and 3D-AFM (KLA Tencor HRP340 & Bruker Nano X3D)
- XRD (Bede HR, video system, micro focus X-ray tube)
- Defect inspection (KLA Tencor SP3 SurfScan & Applied Materials G3E FIB, AMAT Verity CD SEM, NextIn Solutions AEGIS Wafer Inspection System)
- Film thickness wafer-mapping (KLA Tencor Spectra FX100)
- Sheet resistivity (EURIS WS3000 & KLA Tencor RS100)
Points of Contact
Dr. Nora Haufe
Web:
Phone:
+49 351 26 07-3020
Associated Services
| Name | Preview | Actions |
|---|---|---|
| Analytics and Metrology |
Last Update
Last updated at: 20 December 2024 at 14:22:54