View all instruments of this unit Grinding of surfaces DISCO Corp. DGP8761
Basic Information
| Name: | Grinding of surfaces | |
| Manufacturer: | DISCO Corp. | |
| Model: | DGP8761 | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
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| Inventory number: | GRIND02 | |
Description
Grinding of wafers is used to thin the wafers to the desired thickness, ensuring planarity and surface quality for subsequent processing steps. We ürovide SOI preparation.
Options of instrument usage
- This instrument is used within a service or research collaboration.
Points of Contact
Associated Services
| Name | Preview | Actions |
|---|---|---|
| Depostion of Material on Wafer |
Last Update
Last updated at: 14 January 2025 at 11:26:45