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Depostion of Material on Wafer

Basic Information

Name: Depostion of Material on Wafer
Facility: 200 mm MEMS-Cleanroom
Partner: Fraunhofer Institute for Photonic Microsystems (IPMS)

Description

We offer services on different instruments for different deposition like ALD, CVD, PVD and evaporation. Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) are both chemical processes where gaseous precursors react on the substrate surface to form a thin film. ALD is a variant of CVD that allows for atomic-scale thickness control through sequential, self-limiting surface reactions. Physical Vapor Deposition (PVD), involves vaporizing a solid material and condensing it onto the substrate, this process is faster compared to ALD / CVD but not as accurate. For PVD we offer sputtering and evaporation (heating of the material followed by condensing on the substrate). In addition we also offer all the other nessecary processes for deposition like Chemical Mechanical Polishing, Grinding and Oxidation. 

Types of Service

Points of Contact

Jörg Amelung
Email:
Phone:
+49 351 88 23-4691

Associated Instruments

Name Preview Actions
Oxidation and Tempering
Rapid Thermal Annealing (RTA)
Low-Pressure Chemical Vapor Deposition (LP-CVD)
Grinding of surfaces
Sputtering (PVD)
Atomic Layer Deposition (ALD)
Chemical Mechanical Polishing (CMP)
Plasma-Enhanced Chemical Vapor Deposition (PE-CVD)

Last Update

Last updated at: 14 January 2025 at 15:34:26