Depostion of Material on Wafer
Basic Information
Name: | Depostion of Material on Wafer | |
Facility: | 200 mm MEMS-Cleanroom | |
Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
Description
We offer services on different instruments for different deposition like ALD, CVD, PVD and evaporation. Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) are both chemical processes where gaseous precursors react on the substrate surface to form a thin film. ALD is a variant of CVD that allows for atomic-scale thickness control through sequential, self-limiting surface reactions. Physical Vapor Deposition (PVD), involves vaporizing a solid material and condensing it onto the substrate, this process is faster compared to ALD / CVD but not as accurate. For PVD we offer sputtering and evaporation (heating of the material followed by condensing on the substrate). In addition we also offer all the other nessecary processes for deposition like Chemical Mechanical Polishing, Grinding and Oxidation.
Types of Service
- This service is provided as a standard/ routine service without research activity.
- This service is provided as a research activity e.g. as a development or improvement of methods tools or within research collaborations.
Points of Contact
Associated Instruments
Last Update
Last updated at: 14 January 2025 at 15:34:26