View all instruments of this unit Wet Etch AP&S; ClassOne Technology Manual wet bench; Trident SAT
Basic Information
| Name: | Wet Etch | |
| Manufacturer: | AP&S; ClassOne Technology | |
| Model: | Manual wet bench; Trident SAT | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
| Inventory number: | WET-ETCHXX; WET-SAT01 | |
Description
Wet etching, also known as chemical etching, is a process used in semiconductor manufacturing where a wafer is immersed in a chemical solution to selectively remove specific layers or materials
- Silicon Oxide (NH4F-buffered HF)
- Silicon Nitride (Phosphoric Acid)
- Aluminum (Phosphoric & Acetic Acid)
- Anisotropic Si Etch for Grooves, Membranes (TMAH)
- Spray Acid Tool (Titan-Salicide-Process)
Options of instrument usage
- This instrument is used within a service or research collaboration.
Points of Contact
Associated Services
| Name | Preview | Actions |
|---|---|---|
| Etching and cleaning of wafers |
Last Update
Last updated at: 14 January 2025 at 13:32:14