View all services of this unit Etching and cleaning of wafers
Basic Information
| Name: | Etching and cleaning of wafers | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
Description
We offer different processes for etching and cleaning of wafers. The processes are; dry Etch, wet etch, Gas Phase Release Techniques, Ashing and Cleaning.
Types of Service
- This service is provided as a standard/ routine service without research activity.
- This service is provided as a research activity e.g. as a development or improvement of methods tools or within research collaborations.
Points of Contact
Associated Instruments
| Name | Preview | Actions |
|---|---|---|
| Cleaning of wafer | ||
| Ashing | ||
| Dry etch | ||
| Wet Etch |
Last Update
Last updated at: 14 January 2025 at 12:45:28