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We will provide a link to the successor service once it goes live.
Please do not update any equipment entries here anymore. Use the new portal from now on.
View all services of this unit Etching and cleaning of wafers
Basic Information
| Name: | Etching and cleaning of wafers | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
Description
We offer different processes for etching and cleaning of wafers. The processes are; dry Etch, wet etch, Gas Phase Release Techniques, Ashing and Cleaning.
Types of Service
- This service is provided as a standard/ routine service without research activity.
- This service is provided as a research activity e.g. as a development or improvement of methods tools or within research collaborations.
Points of Contact
Associated Instruments
| Name | Preview | Actions |
|---|---|---|
| Cleaning of wafer | ||
| Ashing | ||
| Dry etch | ||
| Wet Etch |
Last Update
Last updated at: 14 January 2025 at 12:45:28