View all instruments of this unit Wafer Bonding SUSS SB8 & XB8; BA8 Gen3
Basic Information
| Name: | Wafer Bonding | |
| Manufacturer: | SUSS | |
| Model: | SB8 & XB8; BA8 Gen3 | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
| Inventory number: | BOND03-FEOL; BA03-FEOL; BOND04-BEOL; BA04-BEOL | |
Description
- Direct Si / SiO2 and Adhesive Bonding
- Bond Aligner FEOL
- Bond Aligner BEOL
Options of instrument usage
- This instrument is used within a service or research collaboration.
Points of Contact
Associated Services
| Name | Preview | Actions |
|---|---|---|
| Bonding and assembly of wafer |
Last Update
Last updated at: 14 January 2025 at 13:39:52