View all instruments of this unit Wafer Packaging Häcker Automation; Finetech; Ficontec VICO Xtec / Laser; FEMTO; IL2000
Basic Information
| Name: | Wafer Packaging | |
| Manufacturer: | Häcker Automation; Finetech; Ficontec | |
| Model: | VICO Xtec / Laser; FEMTO; IL2000 | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
| Inventory number: | PLACER01; PLACER02; PLACER05 | |
Description
- Pick & Place for Chip Assembly
- Fineplacer
- AOI for chip inspection
Options of instrument usage
- This instrument is used within a service or research collaboration.
Points of Contact
Associated Services
| Name | Preview | Actions |
|---|---|---|
| Bonding and assembly of wafer |
Last Update
Last updated at: 14 January 2025 at 13:50:39