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We will provide a link to the successor service once it goes live.
Please do not update any equipment entries here anymore. Use the new portal from now on.
View all instruments of this unit Wafer Packaging Häcker Automation; Finetech; Ficontec VICO Xtec / Laser; FEMTO; IL2000
Basic Information
| Name: | Wafer Packaging | |
| Manufacturer: | Häcker Automation; Finetech; Ficontec | |
| Model: | VICO Xtec / Laser; FEMTO; IL2000 | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
| Inventory number: | PLACER01; PLACER02; PLACER05 | |
Description
- Pick & Place for Chip Assembly
- Fineplacer
- AOI for chip inspection
Options of instrument usage
- This instrument is used within a service or research collaboration.
Points of Contact
Associated Services
| Name | Preview | Actions |
|---|---|---|
| Bonding and assembly of wafer |
Last Update
Last updated at: 14 January 2025 at 13:50:39