New materials drive innovations in micro- and nanoelectronics. Multiscale materials parameters and solid knowledge of compatibility of laminate materials are needed to integrate new materials into production processes and ensure the functionality, performance, and reliability of microelectronic components. Accurate thermomechanical properties must be available for materials at the wafer level and for packaging (including three-dimensional integration) as input parameters in finite element simulations. Local measurements, e.g., for mechanical stresses, are used for validation and calibration of physical models for estimating the performance and reliability of micro- and nanoelectronic components.

The "Microelectronic Materials and Nanoanalysis" department possesses a unique infrastructural range encompassing high-resolution electron, ion, and X-ray microscopy and offers industry and research partners competent consulting, contract analysis, and methodological development services. Mechanical stresses can be determined down to the nanometer scale. Multiscale analysis of the thermomechanical behavior of microchips and systems generates information on reliability-limiting mechanisms in microelectronic components, e.g., on chip-package interactions (CPIs).

In close cooperation with other Saxonian Fraunhofer institutes in the Dresden Fraunhofer Cluster for Nanoanalysis and Dresden-concept e.V., R&D projects involving all parts of the value and innovation chain from basic research to transfer to industry are completed. Core competencies lie in high-resolution non-destructive X-ray tomography for measurement of micro- and nanostructures as well as for non-destructive defect localization, micro- and nanomechanical testing in combination with electron, ion, and X-ray microscopy, and physical defect analysis for determination of damage and failure mechanisms in microelectronic components.

Services offered

• Non-destructive, high-resolution analysis of material states by radiation techniques (x-ray, laser, infrared techniques)
• Characterization of micro- and nanostructures by microscopic methods (atomic force microscopy with/without ultrasonic excitation, ion, electron and acoustic microscopy)
• 3D x-ray microtomography, nanotomography
• Development of test devices and methods for micro- and nanostructures (indentation, adhesion evaluation, interconnect reliability testing)