The Interconnects group focuses on the metallization, the wiring of active devices and the integration of functionalities in the back- end of line. The extensive know-how in process development and material integration are provided as "Screening Fab" to IC manufacturers, suppliers, material developers and equipment manufacturers.

New equipment, processes and materials are tested and processed by Fraunhofer IPMS-CNT in its own clean room under industrial conditions on 200/300 mm standard equipment. Professional wafer handling and ISO 9001 process management enables a direct wafer exchange and a risk-free integration of innovations with production lines.