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Wafer Coating
Facility: Chair for Semiconductor Technology
Waferbeschichtung - Oxidation, PECVD-, ALD- und PVD-Prozesse für Herstellung funktionaler Schichten und Schichtsysteme, Diffusionsbarrieren, Metallisierungen verschiedener Einsatzbereiche.
Si-deep etching for MEMS, MOEMS and microfluidic
Facility: Chair for Semiconductor Technology
Si-deep etching for MEMS, MOEMS and microfluidic.
Additive and subtractive wiring technology
Facility: Chair for Semiconductor Technology
Additive and subtractive wiring technology - e.g. Damascene structuring.