View all services of this unit Lithography for wafers
Basic Information
| Name: | Lithography for wafers | |
| Facility: | 200 mm MEMS-Cleanroom | |
| Partner: | Fraunhofer Institute for Photonic Microsystems (IPMS) |
|
Description
We offer different Lithography services like exposure, coating, contacting and preparation.
The coating of wafers involves applying a uniform layer of material onto the wafer's surface to enhance its properties and functionality. This process requires precision to ensure the coating is even and free of defects, as variations can lead to performance issues in the final semiconductor devices. We offer spin coating, development and spray Coating with different instruments.
As a next step we offer as a exposure technique Deep Ultraviolet (DUV) lithography to transfer circuit patterns onto wafers with high precision.
Link to Further Details
Types of Service
- This service is provided as a standard/ routine service without research activity.
- This service is provided as a research activity e.g. as a development or improvement of methods tools or within research collaborations.
Points of Contact
Associated Instruments
| Name | Preview | Actions |
|---|---|---|
| Coating | ||
| Preparation for Lithography of wafers | ||
| Contract, Proximity | ||
| Deep Ultraviolet (DUV)- Lithography |
Last Update
Last updated at: 14 January 2025 at 09:41:26