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Oxidation and Tempering Inotherm; TEL; Centroterm; Inotherm LDS200-2; Alpha 8SE; E1550 HT 320-4; E1550-310-5; LDS-200-2

Basic Information

Name: Oxidation and Tempering
Manufacturer: Inotherm; TEL; Centroterm; Inotherm
Model: LDS200-2; Alpha 8SE; E1550 HT 320-4; E1550-310-5; LDS-200-2
Facility: 200 mm MEMS-Cleanroom
Partner: Fraunhofer Institute for Photonic Microsystems (IPMS)
Inventory number: CVD01-LP, FUR04, FUR06, FUR03

Description

Oxidation can be used to create a protective silicon dioxide layer on the wafer. 

We offer different instruments for the oxidation process. 

  • POCl3 (LDS200-2 | Inotherm)
  • Thermal, SiO2 (vertical) (Alpha 8SE | TEL)
  • SiC High Temperature Furnace up to 1200°C (E1550 HT 320-4 | Centroterm) 

With E1550-310-5 | Centroterm is is also possible to perform oxidation and temperting. 

  • Dry / wet oxidation 600 °C - 1050 °C

Horizontal Tempering and H2 tempering with LDS200-2 | Inotherm.

Options of instrument usage

Points of Contact

Jörg Amelung
Email:
Phone:
+49 351 88 23-4691

Associated Services

Name Preview Actions
Depostion of Material on Wafer

Last Update

Last updated at: 14 January 2025 at 11:05:55