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Metrology and Inspection

Basic Information

Name: Metrology and Inspection
Facility: 200 mm MEMS-Cleanroom
Partner: Fraunhofer Institute for Photonic Microsystems (IPMS)

Description

Metrology and inspection are crucial processes in semiconductor manufacturing, ensuring the accuracy and quality of wafers by measuring critical dimensions and detecting defects at various stages of processes. With our instruments we can perform thickness measurements, surface characterization, defect classification, sheet resistance and stress. 

Types of Service

Points of Contact

Jörg Amelung
Email:
Phone:
+49 351 88 23-4691

Associated Instruments

Name Preview Actions
Surface Characterization
4-point measuring station for Sheet resistance
Defect Measurement
Wafer Inspection
Critical Dimension Scanning Electron Microscope (CD-SEM)
Ellipsometer
X-Ray Diffractometer (XRD)
White-Light Interferometer (Optical Profiler)
Wafer measurement
Stress measurement
Film Thickness Measurement

Last Update

Last updated at: 14 January 2025 at 14:07:38