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View the profile: Fraunhofer Institute for Photonic Microsystems (IPMS)

Equipment of Fraunhofer Institute for Photonic Microsystems (IPMS)

Fraunhofer Institute for Photonic Microsystems (IPMS)
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Wafer Bonding

Manufacturer: SUSS
Model: SB8 & XB8; BA8 Gen3
Facility: 200 mm MEMS-Cleanroom

 

Wet Etch

Manufacturer: AP&S; ClassOne Technology
Model: Manual wet bench; Trident SAT
Facility: 200 mm MEMS-Cleanroom

 

Cleaning of wafer

Manufacturer: AP&S; Screen; PEMgroup
Model: GigaStep; SS-80BW-AVR; Cintillio SST
Facility: 200 mm MEMS-Cleanroom

 

Ashing

Manufacturer: tfd;Tryman
Model: GIGAbatch 380M; NEO2232
Facility: 200 mm MEMS-Cleanroom

 

Gas Phase Release Techniques

Manufacturer: KLA
Model: Monarch and Xetch
Facility: 200 mm MEMS-Cleanroom

 

Dry etch

Manufacturer: LAM; SPTS
Model: ALLIANCE 9600PTX; Omega fxP
Facility: 200 mm MEMS-Cleanroom

 

Grinding of surfaces

Manufacturer: DISCO Corp.
Model: DGP8761
Facility: 200 mm MEMS-Cleanroom

 

Chemical Mechanical Polishing (CMP)

Manufacturer: Applied Materials
Model: DESICA
Facility: 200 mm MEMS-Cleanroom

 

Rapid Thermal Annealing (RTA)

Manufacturer: OEMgroup
Model: Heatpuls 8800
Facility: 200 mm MEMS-Cleanroom

 

Oxidation and Tempering

Manufacturer: Inotherm; TEL; Centroterm; Inotherm
Model: LDS200-2; Alpha 8SE; E1550 HT 320-4; E1550-310-5; LDS-200-2
Facility: 200 mm MEMS-Cleanroom

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